https://data.archives-ouvertes.fr/author/172505

https://data.archives-ouvertes.fr/author/172505

http://xmlns.com/foaf/0.1/topic_interest Characterization
http://xmlns.com/foaf/0.1/topic_interest Modelling
http://xmlns.com/foaf/0.1/topic_interest Optimization
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/info.info-ts
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/spi.signal
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/spi.opti
http://www.w3.org/1999/02/22-rdf-syntax-ns#type http://xmlns.com/foaf/0.1/Person
http://xmlns.com/foaf/0.1/topic_interest Photonic interposer
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/spi.nano
http://xmlns.com/foaf/0.1/mbox_sha1sum 353729d0c6d4897f032fa423027a30ac
http://xmlns.com/foaf/0.1/topic_interest Wideband
http://xmlns.com/foaf/0.1/firstName B.
http://xmlns.com/foaf/0.1/topic_interest Dielectric
http://xmlns.com/foaf/0.1/topic_interest Extraction
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/spi.tron
http://xmlns.com/foaf/0.1/topic_interest Ferroelectric Material
http://xmlns.com/foaf/0.1/topic_interest Packaging
http://xmlns.com/foaf/0.1/topic_interest 3-D IC
http://xmlns.com/foaf/0.1/topic_interest Molding
http://xmlns.com/foaf/0.1/topic_interest Electromagnetic Simulation
http://xmlns.com/foaf/0.1/topic_interest Interposer
http://xmlns.com/foaf/0.1/topic_interest TSV
http://xmlns.com/foaf/0.1/topic_interest 3D integration
http://www.openarchives.org/ore/terms/isAggregatedBy https://data.archives-ouvertes.fr/author/bernard-flechet
http://xmlns.com/foaf/0.1/topic_interest Microwave measurements
http://xmlns.com/foaf/0.1/topic_interest High frequencies
http://xmlns.com/foaf/0.1/topic_interest Tunable devices
http://www.w3.org/2002/07/owl#sameAs 102939373
http://xmlns.com/foaf/0.1/topic_interest Loss tangent
http://xmlns.com/foaf/0.1/topic_interest Physical Sciences
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/spi.elec
http://xmlns.com/foaf/0.1/familyName Fléchet
http://xmlns.com/foaf/0.1/topic_interest Complex permittivity
http://xmlns.com/foaf/0.1/topic_interest Thin films
http://xmlns.com/foaf/0.1/topic_interest Ferroelectric materials
http://xmlns.com/foaf/0.1/topic_interest 3D Interconnect
http://xmlns.com/foaf/0.1/name B. Fléchet
http://xmlns.com/foaf/0.1/topic_interest Microwave devices
http://xmlns.com/foaf/0.1/topic_interest Chain modeling
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/phys.cond.cm-gen
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/phys.cond.cm-ms
http://xmlns.com/foaf/0.1/topic_interest Dielectric measurements
http://xmlns.com/foaf/0.1/topic_interest MIM capacitors
http://xmlns.com/foaf/0.1/topic_interest Scattering parameters
http://xmlns.com/foaf/0.1/topic_interest CMOS 32 nm
http://xmlns.com/foaf/0.1/topic_interest Molding material
http://xmlns.com/foaf/0.1/interest https://data.archives-ouvertes.fr/subject/spi.mat
http://xmlns.com/foaf/0.1/topic_interest High frequencies HFs
http://xmlns.com/foaf/0.1/topic_interest 3DIC
http://xmlns.com/foaf/0.1/topic_interest Electrical properties
http://xmlns.com/foaf/0.1/topic_interest Dielectric Characterization
http://xmlns.com/foaf/0.1/topic_interest Permittivity
http://xmlns.com/foaf/0.1/topic_interest Ultra-Low-K
https://aurehal.archives-ouvertes.fr/author/172505

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