"Characterization"@en . "Modelling"@en . "Optimization"@en . . . . . "Photonic interposer"@en . . "353729d0c6d4897f032fa423027a30ac" . "Wideband"@en . "B." . "Dielectric"@en . "Extraction"@en . . "Ferroelectric Material"@en . "Packaging"@en . "3-D IC"@en . "Molding"@en . "Electromagnetic Simulation"@en . "Interposer"@en . "TSV"@en . "3D integration"@en . . "Microwave measurements"@en . "High frequencies"@en . "Tunable devices"@en . <102939373> . "Loss tangent"@en . "Physical Sciences"@en . . "Fl\u00E9chet" . "Complex permittivity"@en . "Thin films"@en . "Ferroelectric materials"@en . "3D Interconnect"@en . "B. Fl\u00E9chet" . "Microwave devices"@en . "Chain modeling"@en . . . "Dielectric measurements"@en . "MIM capacitors"@en . "Scattering parameters"@en . "CMOS 32 nm"@en . "Molding material"@en . . "High frequencies HFs"@en . "3DIC"@en . "Electrical properties"@en . "Dielectric Characterization"@en . "Permittivity"@en . "Ultra-Low-K"@en .